As miniaturized, lightweight, high operating frequency, and high-reliability electronic products continue to occupy the consumer market, electronic components have gradually entered the development stage of high density, high function, miniaturization, multi-pin, and narrow spacing. The requirements for micro-assembly technology are getting higher and higher.
Electronic micro-assembly technology is a new type of electronic assembly and packaging technology developed at a high speed under such a trend.

micro-assembly bonding

Combining the definitions and viewpoints of various advanced manufacturing fields, micro-assembly technology is mainly composed of surface mount (SMT), hybrid integrated circuit (HIC) technology and multi-chip module (MCM) technology.
Generally speaking, micro-assembly technology comprehensively uses advanced methods such as high-density multi-layer substrate technology, multi-chip assembly technology, three-dimensional assembly technology and system-level assembly technology to integrate micro and small electronic components on high-density multi-layer interconnected circuit boards. Electronic products assembled into high-density, high-speed, and high-reliability three-dimensional structures can be understood as high-density electronic assembly technology.

The products involved in electronic microassembly are very rich, including: discrete electronic components, hybrid integrated circuits, multi-chip components, board-level components, microwave components, SiP, microsystems, vacuum electronic devices, etc.
At present, electronic micro-assembly technology has been widely used in the fields of Micro LED/Mini LED display chips, mobile phone micro components, MEMS devices, radio frequency devices, microwave devices and hybrid circuits, and has become one of the important symbols of advanced electronic manufacturing technology.

The core process of micro-assembly equipment - patch

Micro-assembly equipment is an automated equipment that integrates optics, mechanics, and electricity. It uses pressure, heating, and ultrasound to complete the wire bonding process between the chip and the substrate. The micro-assembly process has very high requirements for mounting accuracy. Therefore, the high-precision placement welding head plays a very critical role.
Due to the high assembly density of components, and the assembly material is not only the fixed material of the structure, but also the resistance/capacitance/inductance element of the circuit, there are many complex components and ultra-small devices, which have a high impact on the placement accuracy and alignment angle accuracy requirements.

In addition, these components are fragile and variable, so it is also very important to use precise pressure control to ensure the safe picking of components during the placement process.
Especially in micro-assembly, there are usually various exposed functional structures on the surface of MEMS devices. How to accurately locate the pick-up position on the surface of the component and control the pressure of pick-up and placement has become a difficulty and focus in the placement process.

Fine and controllable bonding pressure to reduce loss
Goal Tech linear rotary motor has a "soft landing" function, which can realize stable force control within ±1.5g, supports programmed setting of speed, acceleration and force control, so that the placement head can touch the component with very light pressure , reduce loss.

Breakthrough Z-axis design to increase speed
Adopting an integrated highly integrated design, the traditional "servo motor + ball screw" is combined into one, which solves the problem of Z-axis self-weight load, reduces the weight of the body and saves the internal space of the equipment, and greatly improves the placement speed.

High-precision alignment and placement to ensure yield
With force control accuracy of ±0.01N, linear repeatability accuracy of ±2μm, and rotational repeatability accuracy of ±0.01°, it can still output stably under high-speed operation to ensure production yield.

With the rapid expansion of electronic micro-assembly technology, the boundaries between semiconductor technology, packaging technology and system-in-package products have become more and more blurred, and the direction of their development has also tended to be the same, that is, towards high density, high precision, and multi-function, three-dimensional, intelligent trend development.
Manufacturers of electronic micro-assembly equipment can only take the lead in the fierce market competition only by keenly grasping the development of the industry and accelerating the improvement of equipment accuracy and production yield. We sincerely invite you to cooperate with Goal Tech Motor to start mutual benefit and win-win situation.